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| NCP4682, NCP4685 150 mA, Ultra Low Supply Current, Low Dropout Regulator The NCP4682 and NCP4685 are CMOS Low Dropout Linear voltage regulators with 150 mA output current capability. The devices have high output voltage accuracy, a 1 mA (typ.) ultra low supply current and high ripple rejection. Current fold-back protection is integrated in the devices to protect against over current and short current conditions. A Chip Enable (NCP4682 only) function is included to save power by further lowering supply current, which is advantageous for battery powered applications. The NCP4685 is optimized for the lowest quiescent current possible in applications where the device is always on. Features http://onsemi.com MARKING DIAGRAMS SOT-23-5 CASE 1212 XXX MG G * * * * * * * * * * * * * * * * Operating Input Voltage Range: 1.70 V to 5.25 V Output Voltage Range: 1.2 V to 3.3 V (available in 0.1 V steps) Output Voltage Accuracy: 0.8% Excellent Output Voltage Temperature Coefficient : 40 ppm/C Supply Current: 1.0 mA (excluding CE pull down current) Standby Current: 0.1 mA Dropout Voltage: 0.24 V (IOUT = 150 mA, VOUT = 2.8 V) Line Regulation: 0.02%/V Typ. Stable with Ceramic Capacitors: 0.1 mF or more Current Fold Back Protection Available in UDFN4 1.0 x 1.0 mm, SC-82AB, SOT23 Packages These are Pb-Free Devices Battery-Powered Equipment Networking and Communication Equipment Cameras, DVRs, STB and Camcorders Home Appliances xxx M G SC-82AB CASE 419C 1 1 UDFN4 CASE 517BR 1 XX MM Typical Applications XX, XXX= Specific Device Code M, MM = Date Code A = Assembly Location Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 19 of this data sheet. VIN NCP4682x VIN CE VOUT GND VOUT VIN C1 100n NCP4685x VIN VOUT GND VOUT C1 100n C2 100n C2 100n Figure 1. Typical Application Schematics (c) Semiconductor Components Industries, LLC, 2011 January, 2011 - Rev. 0 1 Publication Order Number: NCP4682/D NCP4682, NCP4685 VIN VOUT VIN VOUT Vref Vref CE Current Limit CE GND Current Limit GND NCP4682Hxxxx NCP4682Dxxxx VIN VOUT Vref NC Current Limit GND NCP4685Exxxx Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. UDFN1010* 1 2 3 4 - Pin No. SC-82AB 3 2 1 4 - Pin No. SOT23 5 2 3 1 4 Pin Name VOUT GND CE/NC VIN NC Output pin Ground Chip enable pin (Active "H") / No connection Input pin No connection Description *Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. ABSOLUTE MAXIMUM RATINGS Rating Input Voltage (Note 1) Output Voltage Chip Enable Input Output Current Power Dissipation UDFN1010 Symbol VIN VOUT VCE IOUT PD Value 6.0 -0.3 to VIN + 0.3 6.0 200 400 Unit V V V mA W http://onsemi.com 2 NCP4682, NCP4685 ABSOLUTE MAXIMUM RATINGS Rating Power Dissipation SC-82AB Power Dissipation SOT23 Junction Temperature Storage Temperature ESD Capability, Human Body Model (Note 2) ESD Capability, Machine Model (Note 2) TJ TSTG ESDHBM ESDMM Symbol PD Value 380 420 -40 to 150 -55 to 125 2000 200 C C V V Unit W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Thermal Characteristics, UDFN 1.0 x 1.0 mm Thermal Resistance, Junction-to-Air Thermal Characteristics, SOT23 Thermal Resistance, Junction-to-Air Thermal Characteristics, SC-82AB Thermal Resistance, Junction-to-Air Symbol RqJA RqJA RqJA Value 250 238 263 Unit C/W C/W C/W ELECTRICAL CHARACTERISTICS -40C TA 85C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.1 mF, unless otherwise noted. Typical values are at TA = +25C. Parameter Operating Input Voltage Output Voltage TA = +25 C -40C TA 85C Output Voltage Temp. Coefficient Line Regulation Load Regulation Dropout Voltage Test Conditions (Note 3) VOUT 2.0 V VOUT < 2.0 V VOUT 2.0 V VOUT < 2.0 V -40C TA 85C VOUT(NOM) + 0.5 V VIN 5.0 V IOUT = 1 mA to 150 mA IOUT = 150 mA 1.2 V VOUT < 1.5 V 1.5 V VOUT < 1.7 V 1.7 V VOUT < 2.0 V 2.0 V VOUT < 2.5 V 2.5 V VOUT < 2.8 V 2.8 V VOUT < 3.3 V Output Current Short Current Limit Quiescent Current Standby Current VCE = 0 V, TA = 25C, NCP4682 only VOUT = 0 V IOUT ISC IQ ISTB 150 40 1.0 0.1 1.5 1.0 DVOUT / DTA LineReg LoadReg VDO Symbol VIN VOUT Min 1.70 x0.992 -16 x0.985 -30 40 0.02 10 0.76 0.53 0.44 0.34 0.28 0.24 0.10 20 1.05 0.80 0.65 0.50 0.40 0.32 mA mA mA mA Typ Max 5.25 x1.008 16 x1.015 30 Unit V V mV V mV ppm/C %/V mV V http://onsemi.com 3 NCP4682, NCP4685 ELECTRICAL CHARACTERISTICS -40C TA 85C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.1 mF, unless otherwise noted. Typical values are at TA = +25C. Parameter CE Pin Threshold Voltage (NCP4682 only) CE Pull Down Current Power Supply Rejection Ratio Output Noise Voltage Low Output Nch Tr. On Resistance Test Conditions CE Input Voltage "H" CE Input Voltage "L" NCP4682 only VIN = 2.2 V, VOUT = 1.2 V, DVIN = 0.2 Vpk-pk, IOUT = 30 mA, f = 1 kHz f = 10 Hz to 100 kHz, IOUT = 30 mA, VOUT = 1.2 V, VIN = 2.2 V VIN = 4 V, VCE = 0 V, NCP4682D only Symbol VCEH VCEL ICEPD PSRR VN RLOW 0.3 30 70 30 Min 1.5 0.3 mA dB mVrms W Typ Max Unit V 3. The maximum Input Voltage of the Electrical Characteristics is 5.25 V. In case of exceeding this specification, the IC must be operated n condition that the Input Voltage is up to 5.50 V and total operation time is within 500 hours. http://onsemi.com 4 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 1.4 1.2 1.0 VOUT (V) 0.8 0.6 0.4 0.2 0.0 1.7 V 2.0 V 2.3 V VOUT (V) VIN = 2.6 V 3.0 2.5 2.0 1.5 1.0 0.5 0.0 3.4 V VIN = 2.8 V 3.7 V 3.1 V 0 100 200 300 400 500 0 100 200 300 IOUT (mA) 400 500 IOUT (mA) Figure 3. Output Voltage vs. Output Current 1.2 V Version (TJ = 255C) Figure 4. Output Voltage vs. Output Current 2.5 V Version (TJ = 255C) 3.0 2.5 2.0 VOUT (V) 1.5 1.0 0.5 0.0 3.4 V 3.7 V VOUT (V) 4.1 V VIN = 3.1 V 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 100 200 300 400 500 0.0 0 100 200 300 IOUT (mA) 400 500 VIN = 3.1 V 4.2 V 3.9 V 3.6 V IOUT (mA) Figure 5. Output Voltage vs. Output Current 2.8 V Version (TJ = 255C) 0.90 0.80 0.70 0.60 VDO (V) 0.50 0.40 0.30 0.20 0.10 0.00 0 25 50 75 IOUT (mA) 100 125 150 TJ = 85C 25C -40C VDO (V) 0.30 0.25 0.20 Figure 6. Output Voltage vs. Output Current 3.3 V Version (TJ = 255C) TJ = 85C 0.15 0.10 0.05 0.00 -40C 25C 0 25 50 Figure 7. Dropout Voltage vs. Output Current 1.2 V Version Figure 8. Dropout Voltage vs. Output Current 2.5 V Version 75 IOUT (mA) 100 125 150 http://onsemi.com 5 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 0.30 0.25 0.20 VDO (V) 0.15 0.10 0.05 0.00 TJ = 85C VDO (V) 25C -40C 0.30 0.25 0.20 0.15 0.10 0.05 0.00 25C TJ = 85C -40C 0 25 50 75 IOUT (mA) 100 125 150 0 25 50 75 IOUT (mA) 100 125 150 Figure 9. Dropout Voltage vs. Output Current 2.8 V Version 1.23 VIN = 2.2 V 1.22 1.21 VOUT (V) 1.20 1.19 1.18 1.17 -40 VOUT (V) 2.52 2.51 2.50 2.49 2.48 2.53 Figure 10. Dropout Voltage vs. Output Current 3.3 V Version VIN = 3.5 V -20 0 20 40 60 80 2.47 -40 -20 0 20 40 60 80 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 11. Output Voltage vs. Temperature, 1.2 V Version 2.83 VIN = 3.8 V 2.82 2.81 VOUT (V) VOUT (V) 2.80 2.79 2.78 2.77 -40 3.32 3.31 3.30 3.29 3.28 3.27 -40 3.33 Figure 12. Output Voltage vs. Temperature, 2.5 V Version VIN = 4.3 V -20 0 20 40 60 80 -20 0 20 40 60 80 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 13. Output Voltage vs. Temperature, 2.8 V Version Figure 14. Output Voltage vs. Temperature, 3.3 V Version http://onsemi.com 6 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 2.0 1.8 1.6 1.4 IGND (mA) 1.0 0.8 0.6 0.4 0.2 0.0 0 1 2 3 4 5 VIN, INPUT VOLTAGE (V) IGND (mA) 1.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 1 2 3 4 5 VIN, INPUT VOLTAGE (V) Figure 15. Supply Current vs. Input Voltage, 1.2 V Version 2.0 1.8 1.6 1.4 IGND (mA) IGND (mA) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 1 2 3 4 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 Figure 16. Supply Current vs. Input Voltage, 2.5 V Version 1 2 3 4 5 VIN, INPUT VOLTAGE (V) VIN, INPUT VOLTAGE (V) Figure 17. Supply Current vs. Input Voltage, 2.8 V Version 3.0 VIN = 2.2 V 2.5 2.0 IGND (mA) IGND (mA) 1.5 1.0 0.5 0.0 -40 2.5 2.0 1.5 1.0 0.5 0.0 -40 3.0 Figure 18. Supply Current vs. Input Voltage, 3.3 V Version VIN = 3.5 V -20 0 20 40 60 80 -20 0 20 40 60 80 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 19. Supply Current vs. Temperature, 1.2 V Version http://onsemi.com 7 Figure 20. Supply Current vs. Temperature, 2.5 V Version NCP4682, NCP4685 TYPICAL CHARACTERISTICS 3.0 VIN = 3.8 V 2.5 2.0 IGND (mA) IGND (mA) 1.5 1.0 0.5 0.0 -40 2.5 2.0 1.5 1.0 0.5 0.0 -40 3.0 VIN = 4.3 V -20 0 20 40 60 80 -20 0 20 40 60 80 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 21. Supply Current vs. Temperature, 2.8 V Version 1.4 1.2 1.0 VOUT (V) 0.8 0.6 0.4 0.2 0.0 0 1 2 3 4 5 IOUT = 100 mA 1 mA 30 mA VOUT (V) 50 mA 2.0 1.5 1.0 0.5 3.0 2.5 Figure 22. Supply Current vs. Temperature, 3.3 V Version 1 mA 30 mA 50 mA IOUT = 100 mA 0.0 0 1 2 3 4 5 VIN, INPUT VOLTAGE (V) VIN, INPUT VOLTAGE (V) Figure 23. Output Voltage vs. Input Voltage, 1.2 V Version 3.0 2.5 2.0 VOUT (V) 1.5 30 mA 1.0 0.5 0.0 50 mA IOUT = 100 mA 0 1 2 3 VIN, INPUT VOLTAGE (V) 4 5 1 mA 3.5 3.0 2.5 VOUT (V) 2.0 1.5 1.0 0.5 0.0 0 Figure 24. Output Voltage vs. Input Voltage, 2.5 V Version 1 mA 30 mA 50 mA IOUT = 100 mA 1 2 3 VIN, INPUT VOLTAGE (V) 4 5 Figure 25. Output Voltage vs. Input Voltage, 2.8 V Version Figure 26. Output Voltage vs. Input Voltage, 3.3 V Version http://onsemi.com 8 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 60 50 40 30 20 10 0 0.1 150 mA 1 10 FREQUENCY (kHz) 100 1000 IOUT = 1 mA 60 50 40 30 20 10 0 0.1 1 10 FREQUENCY (kHz) 100 1000 150 mA IOUT = 1 mA 30 mA 30 mA Figure 27. PSRR, 1.2 V Version, VIN = 2.2 V 60 50 40 PSRR (dB) 30 20 10 0 0.1 150 mA 1 10 FREQUENCY (kHz) 100 1000 PSRR (dB) IOUT = 1 mA 30 mA 60 50 40 30 20 10 0 0.1 PSRR (dB) PSRR (dB) Figure 28. PSRR, 2.5 V Version, VIN = 3.5 V IOUT = 1 mA 30 mA 150 mA 1 10 FREQUENCY (kHz) 100 1000 Figure 29. PSRR, 2.8 V Version, VIN = 3.8 V 3.0 2.5 VN (mVrms/Hz) VN (mVrms/Hz) 2.0 1.5 1.0 0.5 0 0.01 2.5 2.0 1.5 1.0 0.5 0 0.01 Figure 30. PSRR, 3.3 V Version, VIN = 4.3 V 0.1 1 10 100 1000 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 31. Output Voltage Noise, 1.2 V Version, VIN = 2.2 V Figure 32. Output Voltage Noise, 2.5 V Version, VIN = 3.5 V http://onsemi.com 9 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 7.0 6.0 5.0 VN (mVrms/Hz) 4.0 3.0 2.0 1.0 0 0.01 0.1 1 10 FREQUENCY (kHz) 100 1000 VN (mVrms/Hz) 18 16 14 12 10 8 6 4 2 0 0.01 0.1 1 10 FREQUENCY (kHz) 100 1000 Figure 33. Output Voltage Noise, 2.8 V Version, VIN = 3.8 V Figure 34. Output Voltage Noise, 3.3 V Version, VIN = 4.3 V 3.7 3.2 2.7 2.2 VOUT (V) 1.8 1.6 1.4 1.2 1.0 0.8 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 VIN (V) 2.0 Figure 35. Line Transients, 1.2 V Version, tR = tF = 5 ms, IOUT = 30 mA 5.0 4.5 4.0 3.5 VOUT (V) 3.1 2.9 2.7 2.5 2.3 2.1 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 VIN (V) 3.3 Figure 36. Line Transients, 2.5 V Version, tR = tF = 5 ms, IOUT = 30 mA http://onsemi.com 10 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 5.3 4.8 4.3 3.8 VOUT (V) 3.4 3.2 3.0 2.8 2.6 2.4 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 VIN (V) 3.6 Figure 37. Line Transients, 2.8 V Version, tR = tF = 5 ms, IOUT = 30 mA 5.8 5.3 4.8 4.3 VOUT (V) 3.9 3.7 3.5 3.3 3.1 2.9 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 VIN (V) Figure 38. Line Transients, 3.3 V Version, tR = tF = 5 ms, IOUT = 30 mA 45 30 15 0 1.6 1.4 1.2 1.0 0.8 0.6 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 39. Load Transients, 1.2 V Version, IOUT = 1 - 30 mA, tR = tF = 0.5 ms, VIN = 2.2 V http://onsemi.com 11 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 45 30 15 0 2.9 2.7 2.5 2.3 2.1 1.9 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 40. Load Transients, 2.5 V Version, IOUT = 1 - 30 mA, tR = tF = 0.5 ms, VIN = 3.5 V 45 30 15 0 3.2 3.0 2.8 2.6 2.4 2.2 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 41. Load Transients, 2.8 V Version, IOUT = 1 - 30 mA, tR = tF = 0.5 ms, VIN = 3.8 V 45 30 15 0 3.7 3.5 3.3 3.1 2.9 2.7 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 42. Load Transients, 3.3 V Version, IOUT = 1 - 30 mA, tR = tF = 0.5 ms, VIN = 4.3 V http://onsemi.com 12 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 150 100 50 0 1.6 1.4 1.2 1.0 0.8 0.6 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 43. Load Transients, 1.2 V Version, IOUT = 50 - 100 mA, tR = tF = 0.5 ms, VIN = 2.2 V 150 100 50 0 2.9 2.7 2.5 2.3 2.1 1.9 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 44. Load Transients, 2.5 V Version, IOUT = 50 - 100 mA, tR = tF = 0.5 ms, VIN = 3.5 V 150 100 50 0 3.2 3.0 2.8 2.6 2.4 2.2 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 45. Load Transients, 2.8 V Version, IOUT = 50 - 100 mA, tR = tF = 0.5 ms, VIN = 3.8 V http://onsemi.com 13 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 150 100 50 0 3.7 3.5 3.3 3.1 2.9 2.7 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 46. Load Transients, 3.3 V Version, IOUT = 50 - 100 mA, tR = tF = 0.5 ms, VIN = 4.3 V 150 100 50 0 2.2 1.7 1.2 0.7 0.2 -0.3 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 47. Load transients, 1.2 V Version, IOUT = 1 - 100 mA, tR = tF = 0.5 ms, VIN = 2.2 V 150 100 50 0 3.5 3.0 2.5 2.0 1.5 1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 48. Load Transients, 2.5 V Version, IOUT = 1 - 100 mA, tR = tF = 0.5 ms, VIN = 3.5 V http://onsemi.com 14 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 150 100 50 0 3.8 3.3 2.8 2.3 1.8 1.3 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 49. Load Transients, 2.8 V Version, IOUT = 1 - 100 mA, tR = tF = 0.5 ms, VIN = 3.8 V 150 100 50 0 4.3 3.8 3.3 2.8 2.3 1.8 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT (mA) VOUT (V) Figure 50. Load Transients, 3.3 V Version, IOUT = 1 - 100 mA, tR = tF = 0.5 ms, VIN = 4.3 V 3 Chip Enable 2 1 0 VOUT (V) VCE (V) IOUT = 30 mA IOUT = 150 mA 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT = 1 mA 1.5 1.0 0.5 0 -0.5 Figure 51. Start-up, NCP4682 1.2 V Version, VIN = 2.2 V http://onsemi.com 15 NCP4682, NCP4685 TYPICAL CHARACTERISTICS 6 4 Chip Enable 3.0 VOUT (V) 2.5 2.0 1.5 1.0 0.5 0 -0.5 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 IOUT = 1 mA IOUT = 30 mA IOUT = 150 mA 2 0 VCE (V) 6 Chip Enable 4 2 0 VOUT (V) 4.0 3.0 2.0 1.0 0 -1.0 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 IOUT = 150 mA IOUT = 1 mA IOUT = 30 mA VCE (V) 3 2 Chip Enable VOUT (V) 1 0 VCE (V) IOUT = 1 mA IOUT = 30 mA IOUT = 150 mA 0 0.1 0.2 0.3 0.4 0.5 t (ms) 0.6 0.7 0.8 0.9 1.0 Figure 52. Start-up, NCP4682 2.8 V Version, VIN = 3.8 V Figure 53. Start-up, NCP4682 3.3 V Version, VIN = 4.3 V 2.0 1.5 1.0 0.5 0 -0.5 Figure 54. Shutdown, NCP4682 1.2 V Version D, VIN = 2.2 V http://onsemi.com 16 NCP4682, NCP4685 6 4 2 3.0 VOUT (V) 2.5 2.0 1.5 1.0 0.5 0 -0.5 0 IOUT = 150 mA 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT = 1 mA IOUT = 30 mA Chip Enable VCE (V) 6 4 2 6.0 VOUT (V) 5.0 4.0 3.0 2.0 1.0 0 -1.0 0 IOUT = 150 mA 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT = 1 mA IOUT = 30 mA Chip Enable 0 VCE (V) 6 4 2 3.0 VOUT (V) 2.5 2.0 1.5 1.0 0.5 0 -0.5 0 IOUT = 150 mA 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 IOUT = 1 mA IOUT = 30 mA Chip Enable 0 VCE (V) 17 0 Figure 55. Shutdown, NCP4682 2.8 V Version D, VIN = 3.8 V Figure 56. Shutdown, NCP4682 3.3 V Version D, VIN = 4.3 V Figure 57. Shutdown, NCP4682 2.8 V Version H, VIN = 3.8 V http://onsemi.com NCP4682, NCP4685 APPLICATION INFORMATION A typical application circuits for NCP4682 and NCP4685 series is shown in Figure 58. VIN C1 100n NCP4682x VIN CE GND VOUT C2 100n VOUT up to specified current capability in normal operation, but when an over current situation occurs, the output voltage and current decrease until the over current condition ends. Typical characteristics of this protection scheme are shown in the Output voltage versus Output current graphs in the characterization section of this datasheet. Enable Operation (NCP4682 Only) VIN C1 100n NCP4685x VIN GND VOUT VOUT C2 100n The enable pin CE may be used for turning the regulator on and off. The IC is switched on when a high level voltage is applied to the CE pin. The enable pin has an internal pull down current source. If the enable function is not needed, connect CE pin to VIN. Output Discharger (NCP4682 Only) The NCP4682D version includes a transistor between VOUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. Thermals Figure 58. Typical Application Schematic Input Decoupling Capacitor (C1) A 0.1 mF ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP4682/5. Higher values and lower ESR improves line transient response. Output Decoupling Capacitor (C2) As a power across the IC increase, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature increase for the part. When the device has good thermal conductivity through the PCB the junction temperature will be relatively low in high power dissipation applications. PCB layout A 0.1 mF ceramic output decoupling capacitor is enough to achieve stable operation of the IC. If a tantalum capacitor is used, and its ESR is high, loop oscillation may result. The capacitors should be connected as close as possible to the output and ground pins. Larger values and lower ESR improves dynamic parameters. Current Limit Make the VIN and GND line as large as practical. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. This regulator includes a fold-back current limiting circuit. This type of protection doesn't limit output current http://onsemi.com 18 NCP4682, NCP4685 ORDERING INFORMATION Device NCP4682DMU12TCG NCP4682DMU15TCG NCP4682DMU18TCG NCP4682DMU25TCG NCP4682DMU28TCG NCP4682DMU30TCG NCP4682DMU33TCG NCP4682HMU18TCG NCP4682HMU28TCG NCP4682HMU33TCG NCP4685EMU30TCG NCP4682DSQ12T1G NCP4682DSQ15T1G NCP4682DSQ18T1G NCP4682DSQ20T1G NCP4682DSQ25T1G NCP4682DSQ28T1G NCP4682DSQ33T1G NCP4685ESQ15T1G NCP4685ESQ25T1G NCP4685ESQ33T1G Nominal Output Voltage 1.2 V 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 1.8 V 2.8 V 3.3 V 3.0 V 1.2 V 1.5 V 1.8 V 2.0 V 2.5 V 2.8 V 3.3 V 1.5 V 2.5 V 3.3 V Description Auto discharge Auto discharge Auto discharge Auto discharge Auto discharge Auto discharge Auto discharge Enable high Enable high Enable high Without enable Auto discharge Auto discharge Auto discharge Auto discharge Auto discharge Auto discharge Auto discharge Without enable Without enable Without enable Marking CA CC CD CH CL CP CR AD AL AR BP R0 R2 R3 R6 R7 S0 S5 N2 N7 P5 Package UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) UDFN4 (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) Shipping 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 10000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *To order other package and voltage variants, please contact your ON Semiconductor sales representative. http://onsemi.com 19 NCP4682, NCP4685 PACKAGE DIMENSIONS SOT-23 5-LEAD CASE 1212-01 ISSUE A A A1 L 5X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DATUM C IS THE SEATING PLANE. DIM A A1 A2 b c D E E1 e L L1 MILLIMETERS MIN MAX --1.45 0.00 0.10 1.00 1.30 0.30 0.50 0.10 0.25 2.70 3.10 2.50 3.10 1.50 1.80 0.95 BSC 0.20 --0.45 0.75 A 5 1 D 4 2 3 B A2 0.05 S E L1 e E1 b 0.10 C M CB S A S C RECOMMENDED SOLDERING FOOTPRINT* 3.30 0.85 5X 0.56 5X 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 20 NCP4682, NCP4685 PACKAGE DIMENSIONS SC-82AB CASE 419C-02 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. 419C-01 OBSOLETE. NEW STANDARD IS 419C-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A B C D F G H J K L N S MILLIMETERS MIN MAX 1.8 2.2 1.15 1.35 0.8 1.1 0.2 0.4 0.3 0.5 1.1 1.5 0.0 0.1 0.10 0.26 0.1 --- 0.05 BSC 0.2 REF 1.8 2.4 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.008 0.016 0.012 0.020 0.043 0.059 0.000 0.004 0.004 0.010 0.004 --- 0.002 BSC 0.008 REF 0.07 0.09 A G D 3 PL N 4 3 C S 1 2 B K F L H J 0.05 (0.002) SOLDERING FOOTPRINT* 1.30 0.0512 0.65 0.026 0.90 0.035 0.70 0.028 0.95 0.037 1.90 0.075 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 21 NCP4682, NCP4685 PACKAGE DIMENSIONS UDFN4 1.0x1.0, 0.65P CASE 517BR-01 ISSUE O D A B L2 DETAIL A 4X L3 2X 2X 0.05 C 0.05 C 0.05 C 0.05 C NOTE 4 SIDE VIEW e DETAIL A 1 D2 45 5 4 3 4X BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EE EE PIN ONE REFERENCE c 0.18 typ E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E e L L2 L3 MILLIMETERS MIN MAX --- 0.60 0.00 0.05 0.10 REF 0.20 0.30 1.00 BSC 0.43 0.53 1.00 BSC 0.65 BSC 0.20 0.30 0.27 0.37 0.02 0.12 TOP VIEW (A3) A 3X 0.43 4X 0.23 3X 0.10 A1 C SEATING PLANE DETAIL B e/2 2 3X RECOMMENDED MOUNTING FOOTPRINT* L 0.65 PITCH DETAIL B PACKAGE OUTLINE 2X D2 b 0.05 0.52 1.30 M CAB NOTE 3 0.53 4X 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 22 NCP4682/D |
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